JPH0142615B2 - - Google Patents
Info
- Publication number
- JPH0142615B2 JPH0142615B2 JP367183A JP367183A JPH0142615B2 JP H0142615 B2 JPH0142615 B2 JP H0142615B2 JP 367183 A JP367183 A JP 367183A JP 367183 A JP367183 A JP 367183A JP H0142615 B2 JPH0142615 B2 JP H0142615B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resin layer
- thermoplastic resin
- chip
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 19
- 229920005992 thermoplastic resin Polymers 0.000 claims description 17
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000002985 plastic film Substances 0.000 claims description 8
- 229920006255 plastic film Polymers 0.000 claims description 8
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP367183A JPS59127828A (ja) | 1983-01-12 | 1983-01-12 | チツプ状フイルムコンデンサ− |
| US06/570,028 US4555746A (en) | 1983-01-12 | 1984-01-11 | Organic chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP367183A JPS59127828A (ja) | 1983-01-12 | 1983-01-12 | チツプ状フイルムコンデンサ− |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59127828A JPS59127828A (ja) | 1984-07-23 |
| JPH0142615B2 true JPH0142615B2 (en]) | 1989-09-13 |
Family
ID=11563884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP367183A Granted JPS59127828A (ja) | 1983-01-12 | 1983-01-12 | チツプ状フイルムコンデンサ− |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127828A (en]) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6194314A (ja) * | 1984-10-15 | 1986-05-13 | 松下電器産業株式会社 | チツプ型金属化プラスチツクフイルムコンデンサ |
| JPS61272917A (ja) * | 1985-05-29 | 1986-12-03 | 東レ株式会社 | コンデンサ |
| JPS62136013A (ja) * | 1985-12-09 | 1987-06-19 | ダイアホイルヘキスト株式会社 | コンデンサ−用ポリエチレン−２，６−ナフタレ−トフイルム |
| JPS62213230A (ja) * | 1986-03-14 | 1987-09-19 | 松下電器産業株式会社 | 金属化フイルムコンデンサ |
| JPH0271507A (ja) * | 1988-09-06 | 1990-03-12 | Soshin Denki Kk | チップ形フィルムコンデンサ |
-
1983
- 1983-01-12 JP JP367183A patent/JPS59127828A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59127828A (ja) | 1984-07-23 |
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